Micro-structural Studies of Thermosonic Cu-Al Bonding Interface
Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to replace expensive Gold (Au) wire material in the semiconductor industry. However, a reliability concern is raised due to void formation at the bonding interface of Copper wire-Aluminum bond pad (Cu-A...
Saved in:
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Trans Tech Publications
2014
|
| Online Access: | http://eprints.utem.edu.my/id/eprint/12158/1/36_AMR_925.pdf http://eprints.utem.edu.my/id/eprint/12158/ http://www.scientific.net |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|