Microstructural and mechanical analysis of Cu and Au interconnect on various bond pads

• Main Authors: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Yeow, See Leong, Lim, Weng Keat, Hng, May Ting
• Format: Article
• Language: English
• Published: Elsevier 2013
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utem.edu.my/id/eprint/9145/1/30_CAP_13.pdf; http://eprints.utem.edu.my/id/eprint/9145/; http://www.journals.elsevier.com/current-applied-physics

Effects of High Temperature Storage (HTS) and bonding toward microstructure change of intermetallic compound (IMC) at the wire bonding interface of 3 types of bond pad (Al, AlSiCu and NiPdAu) were presented in this paper. Optical and electron microscope analyses revealed that the IMC growth rate of...