Micro-structural Studies of Thermosonic Cu-Al Bonding Interface

Thermosonic Copper (Cu) wire interconnection has been under an extensive research and development to replace expensive Gold (Au) wire material in the semiconductor industry. However, a reliability concern is raised due to void formation at the bonding interface of Copper wire-Aluminum bond pad (Cu-A...

Full description

Saved in:
Bibliographic Details
Main Authors: Thangaraj, Joseph Sahaya Anand, Chua, Kok Yau, Jalar, Azman
Format: Article
Language:English
Published: Trans Tech Publications 2014
Online Access:http://eprints.utem.edu.my/id/eprint/12158/1/36_AMR_925.pdf
http://eprints.utem.edu.my/id/eprint/12158/
http://www.scientific.net
Tags: Add Tag
No Tags, Be the first to tag this record!