Ultrafiltration Treatment For Spent Tungsten Slurry Generated By Chemical Polishing Process In Wafer Fabrication Industry For Reuse
Chemical Mechanical Polishing (CMP) is a widely used process to planarize wafers for microelectronic applications. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mechanical action using tungsten slurry. It is a rather complex mixt...
Saved in:
Main Author: | Sanusi, Nur Fatin Amalina Muhammad |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2017
|
Subjects: | |
Online Access: | http://eprints.usm.my/45754/1/Ultrafiltration%20Treatment%20For%20Spent%20Tungsten%20Slurry%20Generated%20By%20Chemical%20Polishing%20Process%20In%20Wafer%20Fabrication%20Industry%20For%20Reuse.pdf http://eprints.usm.my/45754/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Studies Of Antifouling Properties On Ultrafiltration Membrane For Oily Wastewater
by: Chong, Mei Yan
Published: (2017) -
Effect of etching as pre-treatment for electroless copper plating on silicon wafer
by: Mior Shahidina, Shazatul Akmaliah, et al.
Published: (2017) -
Harvesting The Nutrients From Fish Farm Effluent Via Ultrafiltration Process As Foliar Spray
by: Zol, Nur Adlin Mohd
Published: (2022) -
Synthesis Of Monolayer Graphene On Polycrystalline Nickel And Nickel-Copper Bimetallic Catalyst And Study Toward The Reuse Of Nickel Catalyst
by: Seah, Choon Ming
Published: (2016) -
Clarification of guava juice by an ultrafiltration process: analysis on the operating pressure, membrane fouling and juice qualities
by: Omar, J.M., et al.
Published: (2020)