Ultrafiltration Treatment For Spent Tungsten Slurry Generated By Chemical Polishing Process In Wafer Fabrication Industry For Reuse
Chemical Mechanical Polishing (CMP) is a widely used process to planarize wafers for microelectronic applications. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mechanical action using tungsten slurry. It is a rather complex mixt...
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| Format: | Thesis |
| Language: | English |
| Published: |
2017
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| Online Access: | http://eprints.usm.my/45754/1/Ultrafiltration%20Treatment%20For%20Spent%20Tungsten%20Slurry%20Generated%20By%20Chemical%20Polishing%20Process%20In%20Wafer%20Fabrication%20Industry%20For%20Reuse.pdf http://eprints.usm.my/45754/ |
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