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Tungsten Removal From Chemical Mechanical Polishing (CMP) Spent Slurry Using Dowex Monosphere MR-450 Ultrapure Water (UPW) Resin

In the modern semiconductor manufacturing processes, chemical mechanical polishing (CMP) has grown to be an essential part of the production of integrated circuit (IC) manufacturing. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mec...

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Bibliographic Details
Main Author: Shamshuddin Jaya, Haslina
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TP Chemical Technology
Online Access:http://eprints.usm.my/54099/1/Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Spent%20Slurry%20Using%20Dowex%20Monosphere%20MR-450%20Ultrapure%20Water%20%28UPW%29%20Resin_Haslina%20Shamshuddin%20Jaya_K4_2018.pdf
http://eprints.usm.my/54099/
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http://eprints.usm.my/54099/1/Tungsten%20Removal%20From%20Chemical%20Mechanical%20Polishing%20%28CMP%29%20Spent%20Slurry%20Using%20Dowex%20Monosphere%20MR-450%20Ultrapure%20Water%20%28UPW%29%20Resin_Haslina%20Shamshuddin%20Jaya_K4_2018.pdf
http://eprints.usm.my/54099/

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