Ultrafiltration Treatment For Spent Tungsten Slurry Generated By Chemical Polishing Process In Wafer Fabrication Industry For Reuse

Chemical Mechanical Polishing (CMP) is a widely used process to planarize wafers for microelectronic applications. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mechanical action using tungsten slurry. It is a rather complex mixt...

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Bibliographic Details
Main Author: Sanusi, Nur Fatin Amalina Muhammad
Format: Thesis
Language:English
Published: 2017
Subjects:
Online Access:http://eprints.usm.my/45754/1/Ultrafiltration%20Treatment%20For%20Spent%20Tungsten%20Slurry%20Generated%20By%20Chemical%20Polishing%20Process%20In%20Wafer%20Fabrication%20Industry%20For%20Reuse.pdf
http://eprints.usm.my/45754/
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