The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA

Five different types of clean flux and no-clean flux, which are mainly used in flip chip die attach, have been analyzed in respect to the wettability of eutectic solder bump in flip chip PBGA. An experimental study is carried out to measure the spreading area of the eutectic solder bump processed wi...

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Bibliographic Details
Main Authors: Amin N., Cheah A.Y., Kornain Z., Ahmad I.
Other Authors: 7102424614
Format: Conference paper
Published: 2023
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