Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor
Master of Science Microelectronic System Design Engineering
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Thesis |
| Language: | English |
| Published: |
Universiti Malaysia Perlis (UniMAP)
2018
|
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77429 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|