The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar.
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| Main Authors: | , , , |
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| Format: | Working Paper |
| Language: | English |
| Published: |
Kolej Universiti Kejuruteraan Utara Malaysia
2009
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| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/7124 |
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