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The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)

Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar.

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Bibliographic Details
Main Authors: Noor Mariamadzliza, Mohd Nan, Mohabattul Zaman, Bukhari, Ir. Assoc. Prof., Noor Azira, Mohd Noor, Mohd Nazry, Salleh
Format: Working Paper
Language:English
Published: Kolej Universiti Kejuruteraan Utara Malaysia 2009
Subjects:
Printed circuit boards
Printed circuits
Solder pastes
Solder and soldering
Surface mounted device (SMD)
Surface Mount Technology
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/7124
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spelling my.unimap-71242009-09-03T02:30:03Z The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA) Noor Mariamadzliza, Mohd Nan Mohabattul Zaman, Bukhari, Ir. Assoc. Prof. Noor Azira, Mohd Noor Mohd Nazry, Salleh Printed circuit boards Printed circuits Solder pastes Solder and soldering Surface mounted device (SMD) Surface Mount Technology Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar. Surface Mount Technology or SMT is a rapidly evolving field in the manufacture of electronic components, involving either active (transistors, integrated circuits, diodes, etc) or passive (capacitor, resistors, inductors, coils, etc) which do not have leaded connections. This technique which is SMT, replaces the old technique which the older package tended to use through-hole pins, which pass through holes in a printed circuit board and were soldered from below. The pins contributed inductance, and the size of the holes limits the density of the pins. SMT packages are soldered to the surface of a printed circuit board to alleviate this problem. These techniques are applied to the PCB, mounted components and solder paste. The comparison among the application of PCB, mounted components and solder paste in the SMTA will be shared and compared. 2009-09-03T02:30:03Z 2009-09-03T02:30:03Z 2005-05-18 Working Paper p.145-151 http://hdl.handle.net/123456789/7124 en Proceedings of the 1st National Conference on Electronic Design Kolej Universiti Kejuruteraan Utara Malaysia
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Printed circuit boards
Printed circuits
Solder pastes
Solder and soldering
Surface mounted device (SMD)
Surface Mount Technology
spellingShingle Printed circuit boards
Printed circuits
Solder pastes
Solder and soldering
Surface mounted device (SMD)
Surface Mount Technology
Noor Mariamadzliza, Mohd Nan
Mohabattul Zaman, Bukhari, Ir. Assoc. Prof.
Noor Azira, Mohd Noor
Mohd Nazry, Salleh
The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
description Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar.
format Working Paper
author Noor Mariamadzliza, Mohd Nan
Mohabattul Zaman, Bukhari, Ir. Assoc. Prof.
Noor Azira, Mohd Noor
Mohd Nazry, Salleh
author_facet Noor Mariamadzliza, Mohd Nan
Mohabattul Zaman, Bukhari, Ir. Assoc. Prof.
Noor Azira, Mohd Noor
Mohd Nazry, Salleh
author_sort Noor Mariamadzliza, Mohd Nan
title The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
title_short The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
title_full The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
title_fullStr The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
title_full_unstemmed The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)
title_sort application of pcb, mountedccomponents and solder paste in surface mount technology assembly (smta)
publisher Kolej Universiti Kejuruteraan Utara Malaysia
publishDate 2009
url http://dspace.unimap.edu.my/xmlui/handle/123456789/7124
_version_ 1643788697614680064
score 13.222552

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