Description: The application of PCB, mountedcComponents and solder paste in surface mount technology assembly (SMTA)

Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar.

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Bibliographic Details
Main Authors:	Noor Mariamadzliza, Mohd Nan, Mohabattul Zaman, Bukhari, Ir. Assoc. Prof., Noor Azira, Mohd Noor, Mohd Nazry, Salleh
Format:	Working Paper
Language:	English
Published:	Kolej Universiti Kejuruteraan Utara Malaysia 2009
Subjects:	Printed circuit boards Printed circuits Solder pastes Solder and soldering Surface mounted device (SMD) Surface Mount Technology
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/7124
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Description
Summary:	Organized by Kolej Universiti Kejuruteraan Utara Malaysia (KUKUM), 18th - 19th May 2005 at Putra Palace Hotel, Kangar.