Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
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Main Authors: | A. S., Ashikin, G., Omar, N., Tamaldin, S., Jasmee, H. A., Hamid, A., Jalar, F., Che Ani |
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Other Authors: | ghazali@utem.edu.my |
Format: | Article |
Language: | English |
Published: |
Universiti Malaysia Perlis (UniMAP)
2020
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823 |
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