Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

• Main Authors: A. S., Ashikin, G., Omar, N., Tamaldin, S., Jasmee, H. A., Hamid, A., Jalar, F., Che Ani
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Universiti Malaysia Perlis (UniMAP) 2020
• Subjects: Stretchable silver conductive ink; Thermal; Wettability; Surface roughness; Sheet resistance
• Online Access: http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823

Link to publisher's homepage at http://ijneam.unimap.edu.my