Cover Image

Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

Link to publisher's homepage at http://ijneam.unimap.edu.my

Saved in:
Bibliographic Details
Main Authors: A. S., Ashikin, G., Omar, N., Tamaldin, S., Jasmee, H. A., Hamid, A., Jalar, F., Che Ani
Other Authors: ghazali@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2020
Subjects:
Stretchable silver conductive ink
Thermal
Wettability
Surface roughness
Sheet resistance
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-68823
record_format dspace
spelling my.unimap-688232020-12-07T02:20:36Z Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate A. S., Ashikin G., Omar N., Tamaldin S., Jasmee H. A., Hamid A., Jalar F., Che Ani ghazali@utem.edu.my Stretchable silver conductive ink Thermal Wettability Surface roughness Sheet resistance Link to publisher's homepage at http://ijneam.unimap.edu.my Emerging of conductive metal filler in nanoscale like Silver-Filled Conductive Polymer Composite (SFCP) ink is one of the important technology for electronic interconnects future. Among the key challenges in the successful development of such materials are to offer high electrical conductivity and good adhesion in polymer-based substrates without compromising on the mechanical reliability of such devices. This paper discussed the characteristics of Thermoplastic Polyurethane (TPU) based-materials in terms of their sustainability, wettability and SFCP conductivity of thermal effect (room temperature – 25°C), 40°C, 60°C and 80°C). The experimental work involved electrical conductivity measurement using a Four-Point Probe, contact angle measurement and surface roughness analysis. Surface morphology analysis was carried out by using Axioscope 2MAT Optical Microscope and Scanning Electron Microscopic (SEM). The results show that sheet resistance of SFCP increased with an increasing strain and decrease with the increasing of temperature. The above results were observed due to the crack formation against strain but the presents of temperature cause the silver (Ag) particle to expand, filled the gap and form network path for electrical conduction even at maximum temperature and strain (80°C at 80%). Moreover, the TPU shows low wettability that exhibits poor adhesion between SFCP and TPU substrate due to reducing in the contact area between adhesive and substrate that cause the surface has low surface energy when exposed to variation of temperature. 2020-12-07T02:20:36Z 2020-12-07T02:20:36Z 2020-05 Article International Journal of Nanoelectronics and Materials, vol.13(Special Issue), 2020, pages 419-430 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823 http://ijneam.unimap.edu.my en International Symposium on Science, Technology and Engineering (ISSTE 2019); Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Stretchable silver conductive ink
Thermal
Wettability
Surface roughness
Sheet resistance
spellingShingle Stretchable silver conductive ink
Thermal
Wettability
Surface roughness
Sheet resistance
A. S., Ashikin
G., Omar
N., Tamaldin
S., Jasmee
H. A., Hamid
A., Jalar
F., Che Ani
Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 ghazali@utem.edu.my
author_facet ghazali@utem.edu.my
A. S., Ashikin
G., Omar
N., Tamaldin
S., Jasmee
H. A., Hamid
A., Jalar
F., Che Ani
format Article
author A. S., Ashikin
G., Omar
N., Tamaldin
S., Jasmee
H. A., Hamid
A., Jalar
F., Che Ani
author_sort A. S., Ashikin
title Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
title_short Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
title_full Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
title_fullStr Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
title_full_unstemmed Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate
title_sort thermo-mechanical and adhesion performance of silver-filled conductive polymer composite (sfcp) using thermoplastic polyurethane (tpu) substrate
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823
_version_ 1698698525572857856
score 13.214268

Similar Items