Holdings: Thermo-mechanical and adhesion performance of Silver-Filled Conductive Polymer Composite (SFCP) using Thermoplastic Polyurethane (TPU) Substrate

Link to publisher's homepage at http://ijneam.unimap.edu.my

Saved in:

Bibliographic Details
Main Authors:	A. S., Ashikin, G., Omar, N., Tamaldin, S., Jasmee, H. A., Hamid, A., Jalar, F., Che Ani
Other Authors:	ghazali@utem.edu.my
Format:	Article
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2020
Subjects:	Stretchable silver conductive ink Thermal Wettability Surface roughness Sheet resistance
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68823
Tags:	Add Tag No Tags, Be the first to tag this record!