Bump height at low temperature analysis
Link to publisher's homepage at http://www.ttp.net/
Saved in:
Main Authors: | Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Steven, Taniselass |
---|---|
Other Authors: | zaliman@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications (TTP)
2014
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/35388 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Relationship between controllable process parameters on bump height in ENIG
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
The effect of temperature, pH and exposure time to Electroless Nickel Deposition for Under Bump Metallurgy (UBM)
by: Mohd Khairuddin, Md Arshad, et al.
Published: (2009) -
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
by: Mohd Khairuddin, Md Arshad, et al.
Published: (2008) -
Analysis on surface roughness and surface reflectance through DOE
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Desgin and Development of Speed Bump Energy Hanester
by: Darwin A/l Thangarajah
Published: (2023)