Bump height at low temperature analysis
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2014
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my.unimap-353882015-03-24T04:04:06Z Bump height at low temperature analysis Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Steven, Taniselass zaliman@unimap.edu.my rcharan@unimap.edu.my fairul@unimap.edu.my phaklen@unimap.edu.my steven@unimap.edu.my Bump height Controllable parameters DOE ENIG Link to publisher's homepage at http://www.ttp.net/ The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold process time and the bump height. A certain bump height need to be achieved in order to create acceptable solder bumps for reflow process. The study was done using a full factorial design of experiment (DOE). The DOE matrix is made of two levels with two factors. Analysis was done by plotting the main effects plot for each factor. The results suggest that higher process time increases the plating rate where the temperature fixed at 70°C. Electroless nickel time has more influence to the bump height compared to immersion gold time. 2014-06-11T09:17:39Z 2014-06-11T09:17:39Z 2013 Article Applied Mechanics and Materials, vol. 404, 2013, pages 77-81 978-303785845-5 1660-9336 http://www.scientific.net/AMM.404.77 http://dspace.unimap.edu.my:80/dspace/handle/123456789/35388 en Trans Tech Publications (TTP) |
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Universiti Malaysia Perlis |
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English |
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Bump height Controllable parameters DOE ENIG |
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Bump height Controllable parameters DOE ENIG Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Steven, Taniselass Bump height at low temperature analysis |
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Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
zaliman@unimap.edu.my |
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zaliman@unimap.edu.my Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Steven, Taniselass |
| format |
Article |
| author |
Zaliman, Sauli, Dr. Retnasamy, Vithyacharan Fairul Afzal, Ahmad Fuad Ehkan, Phaklen, Dr. Steven, Taniselass |
| author_sort |
Zaliman, Sauli, Dr. |
| title |
Bump height at low temperature analysis |
| title_short |
Bump height at low temperature analysis |
| title_full |
Bump height at low temperature analysis |
| title_fullStr |
Bump height at low temperature analysis |
| title_full_unstemmed |
Bump height at low temperature analysis |
| title_sort |
bump height at low temperature analysis |
| publisher |
Trans Tech Publications (TTP) |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/35388 |
| _version_ |
1643797780037107712 |
| score |
13.222552 |