Cu-SiCp composites as advanced electronic packaging materials

• Main Authors: Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al Bakri, Abdullah, Sandu, A.V.
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Subjects: Electroless copper; Electronic packaging materials; Metal matrix composite (MMC)
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/34512

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