APA Citation

Azmi, K., & azmikamardin@unimap.edu.my. (2014). Cu-SiCp composites as advanced electronic packaging materials. Trans Tech Publications.

Chicago Style Citation

Azmi, Kamardin, and azmikamardin@unimap.edu.my. Cu-SiCp Composites As Advanced Electronic Packaging Materials. Trans Tech Publications, 2014.

MLA Citation

Azmi, Kamardin, and azmikamardin@unimap.edu.my. Cu-SiCp Composites As Advanced Electronic Packaging Materials. Trans Tech Publications, 2014.

Warning: These citations may not always be 100% accurate.