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Cu-SiCp composites as advanced electronic packaging materials

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Main Authors: Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al Bakri, Abdullah, Sandu, A.V.
Other Authors: azmikamardin@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
Subjects:
Electroless copper
Electronic packaging materials
Metal matrix composite (MMC)
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34512
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spelling my.unimap-345122014-05-19T09:36:39Z Cu-SiCp composites as advanced electronic packaging materials Azmi, Kamardin Mohd Nazree, Derman, Dr. Mohd Mustafa Al Bakri, Abdullah Sandu, A.V. azmikamardin@unimap.edu.my Electroless copper Electronic packaging materials Metal matrix composite (MMC) Link to publisher's homepage at http://www.ttp.net/ The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. High interest on Cu-SiCp composites is highlighted by the high thermal conductivity and low coefficient of thermal expansion (CTE) properties. However, the thermal properties of the Cu-SiCp composites are constrained by the bonding between the copper matrix and the silicon carbide particles (SiCp) reinforcement. In the powder metallurgical (PM) methodology in particular, the bonding between the two constituents is weak, thus demoting the thermal properties of the Cu-SiCp composites. In order to improve the interface bonding, the SiCp were copper coated via electroless coating process. Based on the experimental results and findings, a continuous copper deposition on the SiCp was obtained via the electroless plating process. The copper film was found to be high in purity and homogeneously deposited on the SiCp surfaces. The CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites and were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases. 2014-05-19T09:36:39Z 2014-05-19T09:36:39Z 2014 Article Key Engineering Materials, vol.594-595, 2014, pages 852-856 1662-9795 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34512 http://www.scientific.net/KEM.594-595.852 10.4028/www.scientific.net/KEM.594-595.852 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Electroless copper
Electronic packaging materials
Metal matrix composite (MMC)
spellingShingle Electroless copper
Electronic packaging materials
Metal matrix composite (MMC)
Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al Bakri, Abdullah
Sandu, A.V.
Cu-SiCp composites as advanced electronic packaging materials
description Link to publisher's homepage at http://www.ttp.net/
author2 azmikamardin@unimap.edu.my
author_facet azmikamardin@unimap.edu.my
Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al Bakri, Abdullah
Sandu, A.V.
format Article
author Azmi, Kamardin
Mohd Nazree, Derman, Dr.
Mohd Mustafa Al Bakri, Abdullah
Sandu, A.V.
author_sort Azmi, Kamardin
title Cu-SiCp composites as advanced electronic packaging materials
title_short Cu-SiCp composites as advanced electronic packaging materials
title_full Cu-SiCp composites as advanced electronic packaging materials
title_fullStr Cu-SiCp composites as advanced electronic packaging materials
title_full_unstemmed Cu-SiCp composites as advanced electronic packaging materials
title_sort cu-sicp composites as advanced electronic packaging materials
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34512
_version_ 1643797512473018368
score 13.214268

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