Test chip and substrate design for flip chip microelectronic package thermal measurements

• Main Authors: Goh, Teck Joo, Chiu, Chiapin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
• 其他作者: [e-mail]
• 格式: Article
• 语言: English
• 出版: Emerald Group Publishing Limited 2014
• 主题: Finite element analysis; Printed circuits; Tests and testing; Thermal testing
• 在线阅读: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943

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