Goh, T. J., & teck.joo.goh@intel.com. (2014). Test chip and substrate design for flip chip microelectronic package thermal measurements. Emerald Group Publishing Limited.
シカゴスタイル引用形Goh, Teck Joo, and teck.joo.goh@intel.com. Test Chip and Substrate Design for Flip Chip Microelectronic Package Thermal Measurements. Emerald Group Publishing Limited, 2014.
MLA引用形式Goh, Teck Joo, and teck.joo.goh@intel.com. Test Chip and Substrate Design for Flip Chip Microelectronic Package Thermal Measurements. Emerald Group Publishing Limited, 2014.
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