Cover Image

Test chip and substrate design for flip chip microelectronic package thermal measurements

Link to publisher's homepage at http://www.emeraldinsight.com/

Saved in:
Bibliographic Details
Main Authors: Goh, Teck Joo, Chiu, Chiapin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Other Authors: teck.joo.goh@intel.com
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
Finite element analysis
Printed circuits
Tests and testing
Thermal testing
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.unimap-33943
record_format dspace
spelling my.unimap-339432014-04-23T04:38:24Z Test chip and substrate design for flip chip microelectronic package thermal measurements Goh, Teck Joo Chiu, Chiapin Seetharamu, Kankanhally N. Ghulam, Abdul Quadir, Prof. Dr. Zainal Alimuddin, Zainal Alauddin, Dr. teck.joo.goh@intel.com knseetharamu@hotmail.com gaquadir@unimap.edu.my Finite element analysis Printed circuits Tests and testing Thermal testing Link to publisher's homepage at http://www.emeraldinsight.com/ Purpose: This paper's purpose is to review the design of a flip chip thermal test vehicle. Design/methodology/approach: Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined and the design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. The design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also explained. Findings: Describes the design considerations and processes of the package substrate and printed-circuit board with special emphasis on the physical routing of the thermal test chip structures. These design processes are supported with thermal data from various finite-element analyses carried out to evaluate the capability and limitations of thermal test vehicle design. Originality/value: The validation and calibration procedures of a thermal test vehicle are presented in this paper. 2014-04-23T04:38:24Z 2014-04-23T04:38:24Z 2006 Article Microelectronics International, vol. 23(2), 2006, pages 3-10 1356-5362 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943 http://dx.doi.org/10.1108/13565360610669959 http://www.emeraldinsight.com/journals.htm?articleid=1550663 en Emerald Group Publishing Limited
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Finite element analysis
Printed circuits
Tests and testing
Thermal testing
spellingShingle Finite element analysis
Printed circuits
Tests and testing
Thermal testing
Goh, Teck Joo
Chiu, Chiapin
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
Test chip and substrate design for flip chip microelectronic package thermal measurements
description Link to publisher's homepage at http://www.emeraldinsight.com/
author2 teck.joo.goh@intel.com
author_facet teck.joo.goh@intel.com
Goh, Teck Joo
Chiu, Chiapin
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
format Article
author Goh, Teck Joo
Chiu, Chiapin
Seetharamu, Kankanhally N.
Ghulam, Abdul Quadir, Prof. Dr.
Zainal Alimuddin, Zainal Alauddin, Dr.
author_sort Goh, Teck Joo
title Test chip and substrate design for flip chip microelectronic package thermal measurements
title_short Test chip and substrate design for flip chip microelectronic package thermal measurements
title_full Test chip and substrate design for flip chip microelectronic package thermal measurements
title_fullStr Test chip and substrate design for flip chip microelectronic package thermal measurements
title_full_unstemmed Test chip and substrate design for flip chip microelectronic package thermal measurements
title_sort test chip and substrate design for flip chip microelectronic package thermal measurements
publisher Emerald Group Publishing Limited
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943
_version_ 1643797354222977024
score 13.222552

Similar Items