Test chip and substrate design for flip chip microelectronic package thermal measurements

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Bibliographic Details
Main Authors: Goh, Teck Joo, Chiu, Chiapin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
Other Authors: teck.joo.goh@intel.com
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943
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Summary:Link to publisher's homepage at http://www.emeraldinsight.com/