Test chip and substrate design for flip chip microelectronic package thermal measurements

• Main Authors: Goh, Teck Joo, Chiu, Chiapin, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr.
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Emerald Group Publishing Limited 2014
• Subjects: Finite element analysis; Printed circuits; Tests and testing; Thermal testing
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33943

Link to publisher's homepage at http://www.emeraldinsight.com/