Temperature cycling analysis for ball grid array package using finite element analysis

• 主要な著者: Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Dato, Prof. Dr., Ghulam, Abdul Quadir, Prof. Dr.
• その他の著者: [e-mail]
• フォーマット: 論文
• 言語: English
• 出版事項: Emerald Group Publishing Limited 2014
• 主題: Finite element analysis; Joining processes; Soldering; Stress (materials); Surface fitting
• オンライン･アクセス: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33940

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