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Temperature cycling analysis for ball grid array package using finite element analysis

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Bibliographic Details
Main Authors: Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Dato, Prof. Dr., Ghulam, Abdul Quadir, Prof. Dr.
Other Authors: zulazhar@unimap.edu.my
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
Subjects:
Finite element analysis
Joining processes
Soldering
Stress (materials)
Surface fitting
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33940
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spelling my.unimap-339402014-04-23T04:23:38Z Temperature cycling analysis for ball grid array package using finite element analysis Muhammad Nubli, Zulkifli Zul Azhar, Zahid Jamal, Dato, Prof. Dr. Ghulam, Abdul Quadir, Prof. Dr. zulazhar@unimap.edu.my gaquadir@unimap.edu.my Finite element analysis Joining processes Soldering Stress (materials) Surface fitting Link to publisher's homepage at http://www.emeraldinsight.com/ Purpose - The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array (BGA) package. Design/methodology/approach - Thermal cycling test has been used to evaluate the reliability or fatigue life of the solder joints in BGA package using commercially available FEA software, ANSYSe. The effect of different temperature cycling condition is studied by applying different value of dwell time and ramp rate. Two types of analyses are used namely, the physics-based analysis and the statistical-based analysis. Two screening design methods namely, central composite design (CCD) and Box-Behnken Matrix Design method are used to isolate the most important factors amongst six selected design variables. The optimization process is carried out using response surface methodology (RSM). Findings - It is observed that changes in ramp rate produce significant effect in solder fatigue life than changes in dwell time but the dwell time at high temperature has a negligible contribution to solder fatigue life. It has been found that the thickness of the mold has a significant effect on the performance of the solder joint reliability (more than 50 percent) as compared to that from other factors. Besides, the effect of individual factor, the interaction among factors also changes the solder joint reliability. RSM based on Box-Behnken Matrix design offers the highest characteristic solder joint fatigue life with a value of 2,861 cycles. Originality/value - This paper provides a comprehensive method to evaluate the reliability of solder joints in terms of physics and statistical-based analysis. 2014-04-23T04:23:38Z 2014-04-23T04:23:38Z 2011 Article Microelectronics International, vol. 28(1), 2011, pages 17-28 1356-5362 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33940 http://dx.doi.org/10.1108/13565361111097083 http://www.emeraldinsight.com/journals.htm?articleid=1902948& en Emerald Group Publishing Limited
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Finite element analysis
Joining processes
Soldering
Stress (materials)
Surface fitting
spellingShingle Finite element analysis
Joining processes
Soldering
Stress (materials)
Surface fitting
Muhammad Nubli, Zulkifli
Zul Azhar, Zahid Jamal, Dato, Prof. Dr.
Ghulam, Abdul Quadir, Prof. Dr.
Temperature cycling analysis for ball grid array package using finite element analysis
description Link to publisher's homepage at http://www.emeraldinsight.com/
author2 zulazhar@unimap.edu.my
author_facet zulazhar@unimap.edu.my
Muhammad Nubli, Zulkifli
Zul Azhar, Zahid Jamal, Dato, Prof. Dr.
Ghulam, Abdul Quadir, Prof. Dr.
format Article
author Muhammad Nubli, Zulkifli
Zul Azhar, Zahid Jamal, Dato, Prof. Dr.
Ghulam, Abdul Quadir, Prof. Dr.
author_sort Muhammad Nubli, Zulkifli
title Temperature cycling analysis for ball grid array package using finite element analysis
title_short Temperature cycling analysis for ball grid array package using finite element analysis
title_full Temperature cycling analysis for ball grid array package using finite element analysis
title_fullStr Temperature cycling analysis for ball grid array package using finite element analysis
title_full_unstemmed Temperature cycling analysis for ball grid array package using finite element analysis
title_sort temperature cycling analysis for ball grid array package using finite element analysis
publisher Emerald Group Publishing Limited
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33940
_version_ 1643797352767553536
score 13.18916

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