Temperature cycling analysis for ball grid array package using finite element analysis

• Main Authors: Muhammad Nubli, Zulkifli, Zul Azhar, Zahid Jamal, Dato, Prof. Dr., Ghulam, Abdul Quadir, Prof. Dr.
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Emerald Group Publishing Limited 2014
• Subjects: Finite element analysis; Joining processes; Soldering; Stress (materials); Surface fitting
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33940

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