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Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication

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Main Authors:	Muhamad Hafiz, Zan @ Hazizi, Mohd Arif Anuar, Mohd Salleh, Zainal Arifin, Ahmad, Prof., Mohd Mustafa Al-Bakri, Abdullah, Alida, Abdullah, Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
其他作者:	hafizhazizi@unimap.edu.my
格式:	Article
语言:	English
出版:	Trans Tech Publications 2014
主题:	Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu
在线阅读:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33180
标签:	添加标签没有标签, 成为第一个标记此记录!

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