Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication
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Trans Tech Publications
2014
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my.unimap-331802014-03-28T02:01:19Z Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication Muhamad Hafiz, Zan @ Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. Mohd Mustafa Al-Bakri, Abdullah Alida, Abdullah Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. hafizhazizi@unimap.edu.my arifanuar@unimap.edu.my zainal@eng.usm.my mustafa_albakri@unimap.edu.my alida6986@gmail.com vc@unimap.edu.my Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu Link to publisher's homepage at http://www.ttp.net/ The aim of this study was to optimize the compaction process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si3N4 were carefully weighted, mixed and blended in a mechanical alloying machine. Si3N4 were added to the Sn-0.7Cu solder as reinforcement.After 6 hours of mixing and blending, the powders were later compacted into a thin disc at 5 different pressures. Densities and volumes of the compacted samples were then obtained by using MicromeriticsAccuPyc II 1340 Gas Pycnometer. All data were analyzed and compared with each other in order to select the best parameter for compaction pressure. Results showed that at 140 bars, the porosity percentage is the lowest. Hence, it was decided that 140 bars is the best parameter for compaction process. 2014-03-28T02:01:19Z 2014-03-28T02:01:19Z 2013 Article Applied Mechanics and Materials, vol. 421, 2013, pages 267-271 978-303785878-3 1660-9336 http://www.scientific.net/AMM.421.267 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33180 en Trans Tech Publications |
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English |
| topic |
Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu |
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Composite Lead-free solder Powder metallurgy Silicon nitride Sn-0.7Cu Muhamad Hafiz, Zan @ Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. Mohd Mustafa Al-Bakri, Abdullah Alida, Abdullah Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication |
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Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
hafizhazizi@unimap.edu.my |
| author_facet |
hafizhazizi@unimap.edu.my Muhamad Hafiz, Zan @ Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. Mohd Mustafa Al-Bakri, Abdullah Alida, Abdullah Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. |
| format |
Article |
| author |
Muhamad Hafiz, Zan @ Hazizi Mohd Arif Anuar, Mohd Salleh Zainal Arifin, Ahmad, Prof. Mohd Mustafa Al-Bakri, Abdullah Alida, Abdullah Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. |
| author_sort |
Muhamad Hafiz, Zan @ Hazizi |
| title |
Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication |
| title_short |
Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication |
| title_full |
Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication |
| title_fullStr |
Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication |
| title_full_unstemmed |
Compaction optimization of Sn-Cu-Si3N4via powder metallurgy route for composite solder fabrication |
| title_sort |
compaction optimization of sn-cu-si3n4via powder metallurgy route for composite solder fabrication |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/33180 |
| _version_ |
1643797091139452928 |
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13.214268 |