Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

• Main Authors: Chong, Leong Gan, Uda
• 其他作者: [e-mail]
• 格式: Article
• 語言: English
• 出版: Springer Science+Business Media New York 2014
• 主題: Component reliability; Reliability assessments; Mechanical characterizations; High temperature storage lives
• 在線閱讀: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33099

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