实物特征: Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

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书目详细资料
Main Authors:	Chong, Leong Gan, Uda
其他作者:	chong-leong.gan@spansion.com
格式:	Article
语言:	English
出版:	Springer Science+Business Media New York 2014
主题:	Component reliability Reliability assessments Mechanical characterizations High temperature storage lives
在线阅读:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33099
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实物特征
总结:	Link to publisher's homepage at http://link.springer.com/