Chong, L. G., & chong-leong.gan@spansion.com. (2014). Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package. Springer Science+Business Media New York.
Chicago Style CitationChong, Leong Gan, and chong-leong.gan@spansion.com. Reliability Assessment and Mechanical Characterization of Cu and Au Ball Bonds in BGA Package. Springer Science+Business Media New York, 2014.
MLA引文Chong, Leong Gan, and chong-leong.gan@spansion.com. Reliability Assessment and Mechanical Characterization of Cu and Au Ball Bonds in BGA Package. Springer Science+Business Media New York, 2014.
警告：这些引文格式不一定是100％准确.