Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
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Main Authors: | Lin-Ngee, Ho, Teng, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, Ota, Koyu |
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Other Authors: | holingee@yahoo.com |
Format: | Article |
Language: | English |
Published: |
Springer
2011
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/13151 |
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