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Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

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Main Authors: Lin-Ngee, Ho, Teng, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, Ota, Koyu
Other Authors: holingee@yahoo.com
Format: Article
Language:English
Published: Springer 2011
Subjects:
Electrical reliability
Copper alloy filler
Cu-Ag
Online Access:http://dspace.unimap.edu.my/xmlui/handle/123456789/13151
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spelling my.unimap-131512011-07-14T01:43:14Z Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives Lin-Ngee, Ho Teng, Fei Wu Nishikawa, Hiroshi Takemoto, Tadashi Miyake, Koichi Fujita, Masakazu Ota, Koyu holingee@yahoo.com Electrical reliability Copper alloy filler Cu-Ag Link to publisher's homepage at http://www.springerlink.com/ The thermal stability and electrical reliability of electrically conductive adhesives (ECAs) filled with Cu fillers alloying with different amount of Ag and Mg (0.2-1.5 at.%), respectively, were studied by comparing their electrical resistivity under high temperature exposure at 125 and 85 °C/85% RH for 1,000 h. Results showed that the Cu-Ag filled ECAs were superior to Cu-Mg filled ECAs in terms of thermal stability during aging under high temperature exposure and high humidity condition. A final resistivity on the order of 10-4 -.cm could be maintained for Cu-Ag filled ECAs after aging at 125 °C for 1,000 h. Cu-Mg filled ECAs showed relatively high electrical resistivity compared to Cu-Ag filled ECAs. Resistivity of Cu-Mg filled ECAs increased rapidly over time during high temperature exposure at 125 °C except for Cu-0.5 at.% Mg filled ECA which was thermally stable after 400 h of aging. The ECAs in this study could withstand high temperature exposure at 125 °C better than aging under a combination of elevated temperature and high humidity at 85 °C/85% RH. 2011-07-14T01:43:14Z 2011-07-14T01:43:14Z 2011 Article Journals of Materials Science: Materials in Electronics, vol. 22 (7), 2011, pages 735-740 0957-4522 http://www.springerlink.com/content/g4w54628l0428232/fulltext.pdf http://hdl.handle.net/123456789/13151 en Springer
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Electrical reliability
Copper alloy filler
Cu-Ag
spellingShingle Electrical reliability
Copper alloy filler
Cu-Ag
Lin-Ngee, Ho
Teng, Fei Wu
Nishikawa, Hiroshi
Takemoto, Tadashi
Miyake, Koichi
Fujita, Masakazu
Ota, Koyu
Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
description Link to publisher's homepage at http://www.springerlink.com/
author2 holingee@yahoo.com
author_facet holingee@yahoo.com
Lin-Ngee, Ho
Teng, Fei Wu
Nishikawa, Hiroshi
Takemoto, Tadashi
Miyake, Koichi
Fujita, Masakazu
Ota, Koyu
format Article
author Lin-Ngee, Ho
Teng, Fei Wu
Nishikawa, Hiroshi
Takemoto, Tadashi
Miyake, Koichi
Fujita, Masakazu
Ota, Koyu
author_sort Lin-Ngee, Ho
title Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
title_short Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
title_full Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
title_fullStr Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
title_full_unstemmed Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
title_sort electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
publisher Springer
publishDate 2011
url http://dspace.unimap.edu.my/xmlui/handle/123456789/13151
_version_ 1643789822851022848
score 13.214268

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