Description: Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

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Bibliographic Details
Main Authors:	Lin-Ngee, Ho, Teng, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, Ota, Koyu
Other Authors:	holingee@yahoo.com
Format:	Article
Language:	English
Published:	Springer 2011
Subjects:	Electrical reliability Copper alloy filler Cu-Ag
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/13151
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Summary:	Link to publisher's homepage at http://www.springerlink.com/