Constituents and performance of no-clean flux for electronic solder

• Main Authors: Wakeel, Saif, Abdul Haseeb, A. S. Md., Muhammad Afifi, Amalina, Bingol, Sedat, Hoon, Khoo Ly
• Format: Article
• Published: Elsevier 2021
• Subjects: QC Physics; TA Engineering (General). Civil engineering (General); TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.um.edu.my/27826/

Corrosion reliability is a severe concern related no-clean flux (NCF) residue. It results in a decreased life span of electronic devices, specially fine pitch assemblies. NCFs are formulated from various organic/inorganic components viz. activator, solvent, surfactant, and additive. Each constituent...