Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars
In this work, two commercial no clean fluxes, namely, extremely low residue no-clean flux (NCF) (NC-1) and ordinary NCF (NC-2), were used for the preparation of a fine pitch flip-chip package with a 7.6 x 7.6 mm(2) Si die on a 17 x 17 mm(2) organic substrate. One water-soluble (WS) flux was also use...
Saved in:
Main Authors: | , , , |
---|---|
Format: | Article |
Published: |
IEEE-Inst Electrical Electronics Engineers Inc
2022
|
Subjects: | |
Online Access: | http://eprints.um.edu.my/41404/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!