Uniformity improvement by integrated electrochemical-plating process for CMOS logic technologies

• Main Authors: Wahab, Yasmin Abdul, Fadzil, Anuar, Soin, Norhayati, Fatmadiana, Sharifah, Chowdhury, Zaira Zaman, Hamizi, Nor Aliya, Pivehzhani, Omid Akbarzadeh, Sabapathy, Thennarasan, Al-Douri, Yarub
• Format: Article
• Published: Elsevier 2019
• Subjects: TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.um.edu.my/24257/; https://doi.org/10.1016/j.jmapro.2019.01.025

Reliability of metal interconnects and the integration of inspection and metrology with process tools are advancing rapidly to overcome obstacles in down stream production. A significant drawback associated with metal interconnects which has resulted from the recent trend is the difficulty in obtain...