APA引文

Wahab, Y. A. (2019). Uniformity improvement by integrated electrochemical-plating process for CMOS logic technologies. Elsevier.

Chicago Style Citation

Wahab, Yasmin Abdul. Uniformity Improvement By Integrated Electrochemical-plating Process for CMOS Logic Technologies. Elsevier, 2019.

MLA引文

Wahab, Yasmin Abdul. Uniformity Improvement By Integrated Electrochemical-plating Process for CMOS Logic Technologies. Elsevier, 2019.

警告：这些引文格式不一定是100％准确.