Effect of integrated anneal optimizations of electroplated Cu thin films interconnects

• Main Authors: Wahab, Y. A., Johan, Mohd Rafie, Hamizi, Nor Aliya, Akbarzadeh, O., Chowdhury, Z. Z., Sagadevan, Suresh
• Format: Article
• Published: Elsevier 2020
• Subjects: T Technology (General); TK Electrical engineering. Electronics Nuclear engineering
• Online Access: http://eprints.um.edu.my/36319/

The significance of this paper is to emphasize wafer scale electrochemical plating process optimizations to demonstrate yield-limiting defects reduction. A multiple process enhancement has been implemented to reduce metal ``stress-induced'' voids, crater defects, Cu mound, as well as other...