In-depth study and characterization of insulated Cu wire ball bonding

The increasing market demand for higher pin counts and more chips functionality poses challenges in conventional wire bonding process. The novel insulated Cu wire technology offer potential solution for fine and ultra fine pitch wire bonding as the insulator coating on the bare wire prevents wires...

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Bibliographic Details
Main Authors: Leong, H.Y., Yap, B.K., Navas, K., Mohd Rusli, I., Tan, L.C., Muhammad, F.
Format: Conference or Workshop Item
Language:English
Published: 2013
Subjects:
Online Access:http://eprints.um.edu.my/15611/1/0001.pdf
http://eprints.um.edu.my/15611/
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