Non-Fickian moisture uptake characterisation of epoxy-based moulding compounds with thickness effect
The present work focuses on characterising the moisture uptake behaviour in epoxy-based moulding compounds (EMCs) commonly employed in electronics assembly. Available experimental results on selected EMCs with two different thicknesses of 1.4 mm and 3.0 mm and aged at 60°C/85%RH and 85°C/85%RH are c...
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Main Authors: | Wong, K. J., Tamin, M. N. |
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Format: | Conference or Workshop Item |
Published: |
2015
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Subjects: | |
Online Access: | http://eprints.utm.my/id/eprint/59392/ http://dx.doi.org/10.1109/IEMT.2014.7123120 |
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