Non-Fickian moisture uptake characterisation of epoxy-based moulding compounds with thickness effect

• Main Authors: Wong, K. J., Tamin, M. N.
• Format: Conference or Workshop Item
• Published: 2015
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/59392/; http://dx.doi.org/10.1109/IEMT.2014.7123120

The present work focuses on characterising the moisture uptake behaviour in epoxy-based moulding compounds (EMCs) commonly employed in electronics assembly. Available experimental results on selected EMCs with two different thicknesses of 1.4 mm and 3.0 mm and aged at 60°C/85%RH and 85°C/85%RH are c...