Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology
Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. This material typically consists of metallic particles bounded by polymer bin...
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Main Authors: | Omar, Ghazali, Esa, Siti Rahmah, Sheikh Md Fadzullah, Siti Hajar, Siow, Kim Shyong, Abdul Rahim, Bazura, Cosut, Bunyemin |
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Format: | Article |
Language: | English |
Published: |
Universiti Malaysia Perlis
2020
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Online Access: | http://eprints.utem.edu.my/id/eprint/24862/2/VOL_13_SI_MEI2020_461-472.PDF http://eprints.utem.edu.my/id/eprint/24862/ https://ijneam.unimap.edu.my/images/PDF/IJNEAM%20SPECIAL%20ISSUE%20MEI%202020/Vol_13_SI_Mei2020_461-472.pdf |
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