Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic syst...
Saved in:
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Universitas Ahmad Dahlan
2019
|
| Online Access: | http://eprints.utem.edu.my/id/eprint/24279/2/PAPER.PDF http://eprints.utem.edu.my/id/eprint/24279/ http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/12796/6749 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!