Electronics system thermal management optimization using finite element and nelder-mead method
The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic syst...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Universitas Ahmad Dahlan
2019
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/89744/1/NurulKausarMajid2019_ElectronicsSystemThermalManagement.pdf http://eprints.utm.my/id/eprint/89744/ https://dx.doi.org/10.12928/TELKOMNIKA.v17i5.12796 |
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