Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method
The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic syst...
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| 格式: | Article |
| 語言: | English |
| 出版: |
Universitas Ahmad Dahlan
2019
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| 在線閱讀: | http://eprints.utem.edu.my/id/eprint/24279/2/PAPER.PDF http://eprints.utem.edu.my/id/eprint/24279/ http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/12796/6749 |
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