Electronics System Thermal Management Optimization Using Finite Element And Nelder-Mead Method

The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic syst...

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Bibliographic Details
Main Authors: Ab Majid, Nurul Kausar, Ismail, Fatimah Sham
Format: Article
Language:English
Published: Universitas Ahmad Dahlan 2019
Online Access:http://eprints.utem.edu.my/id/eprint/24279/2/PAPER.PDF
http://eprints.utem.edu.my/id/eprint/24279/
http://journal.uad.ac.id/index.php/TELKOMNIKA/article/view/12796/6749
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