Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].
Pada hari ini, peranti-peranti mikroelektronik menjadi lebih padat, ringan dan mempunyai lebih fungsi, ini termasuklah pakej skala cip-bertingkat (S-CSP). Ia adalah satu teknologi yang memberi opsyen kepadatan pempakejan yang tinggi. Nowadays, microelectronic devices become more compact, lighter...
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Main Author: | Abdullah, Muhammad Khalil |
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Format: | Thesis |
Language: | English |
Published: |
2006
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Subjects: | |
Online Access: | http://eprints.usm.my/9178/1/NUMERICAL_ALGORITHM_OF_STACKED-CHIP_SCALE_PACKAGES.pdf http://eprints.usm.my/9178/ |
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